Chip multilayer inductor
Product features: 1. Small size. 2. Closed circuit, no interactive interference, suitable for high-density installation. 3. Non-directional, standardized automatic patch installation appearance. 4. Excellent solderability and solder resistance, suitable for flow welding and reflow welding.
1. Small size. 2. Closed circuit, no mutual interference, suitable for high-density installation. 3. Non-directional, standardized automatic installation appearance. 4. Excellent solderability and resistance, suitable for flow soldering and reflow soldering.
At present, this product is widely used in notebook computers, digital TVs, digital video recorders, tabulators, hard disk drives, personal computers and their safety, and noise elimination of input and output lines of major computer products.
In practical applications, multilayer inductors can also replace wire-wound inductors, but the following two points should be noted in use:
First of all, when using laminated inductors to replace wire-wound inductors, the parameters of laminated inductors are better and higher than those of wire-wound inductors.
Second, pay attention to the difference between multilayer inductors and wire-wound inductors.
The difference between laminated inductor and wire wound inductor is:
1. The stack has better heat dissipation performance and lower ESR value. But the current resistance is smaller than that of the winding.
2. Winding heat dissipation is not as good as laminated heat dissipation. The ESR value is higher, but the current resistance is larger.
3. Stacking cost is lower than winding cost.